When it comes to the IC substrate, there are a few choices to make. These include FR4, BT, and Flexible film. Learn about their benefits and limitations. Using a high-density substrate is better for IC packaging because it has more rewiring metal layers and a thinner overall thickness.
IC substrates are an important part of many electronic products, from consumer electronics to high-end graphics workstations and servers. As an integral component of many electronic products, IC substrates are designed for high-performance packaging. At the same time, they must meet stringent reliability and performance requirements.
The production of IC substrates is very complex and time-consuming. As a result, the domestic technology for IC substrates is relatively weak. Moreover, the process requires high capital investment. The biggest investment required is in equipment. The manufacturing equipment alone can cost tens of millions of yuan.
BT resin has become one of the most popular laminate materials used in the IC industry. It is the preferred material for chip scale package laminates and BGA substrates. However, the high price tag associated with BT resin is causing many competitors to develop new epoxy alternatives. In this article, we’ll discuss the pros and cons of BT package substrates and examine some of the alternatives available on the market.
Package substrates pcb are often used to protect the core semiconductors of PCs and mobile devices. They are designed to provide a safe environment that protects these expensive components from external stress. Compared to general substrates, they are much more durable and have a higher density. Additionally, these materials contain more microcircuits than general substrates. The resulting increased density helps manufacturers save on costs and assembly defects.
FR4 is a high-density, multi-layer package substrate for high-speed electronics. It is suitable for PCMCIA, MCM-L, and surface mount multi-layer applications. Its electrical properties and ease of processing make it an ideal choice for PCBs.
High-quality laser cutting of FR4 PCB substrate is possible with the correct conditions. This example shows how laser cutting multi-layered FR4 PCB substrates results in a clean cutting surface with minimal fibre and epoxy recession. In addition, the sharpness of the cutting edge is maintained.
IC circuit packaging is one of the most common applications for flexible PCB. The advantages of flexible PCBs over rigid substrates include high-density and high-performance packaging. They are also suitable for flexible electronic systems, including the assembly of ultra-thin chips. The main application forms of flexible substrates in IC packaging are Ball Grid Array, Chip Scale Package, Chip on Film, and Multiple Chip Module.
As technology advances, manufacturers need materials that can withstand varying stresses. Without flexible PCBs, the internal components of electronic devices could buckle under high stress and eventually stop working.
The market for Co-fired ceramic package substrates is growing at a steady pace. The increasing demand for high-frequency and RF electronics, along with rising demand for ceramic components in various industries, are anticipated to spur growth in this market. In addition, technological developments in developing countries will also contribute to the growth of the market.
Co-fired ceramic package substrates are ceramic monolithic devices consisting of a ceramic support structure that integrates conductive, resistive, and dielectric materials into one package. These devices are commonly used for robust assembly of discrete electronic components, multilayer package construction in the electronics industry, and military electronics.